Specification of XC7S75-2FGGA484I | |
---|---|
Status | Active |
Series | Spartan?-7 |
Package | Tray |
Supplier | AMD |
Digi-Key Programmable | Not Verified |
Number of LABs/CLBs | 6000 |
Number of Logic Elements/Cells | 76800 |
Total RAM Bits | 4331520 |
Number of I/O | 338 |
Number of Gates | – |
Voltage – Supply | 0.95V ~ 1.05V |
Mounting Type | Surface Mount |
Operating Temperature | -40C ~ 100C (TJ) |
Package / Case | 484-BGA |
Supplier Device Package | 484-FPBGA (23×23) |
Applications
The XC7S75-2FGGA484I is ideal for high-performance computing environments due to its robust processing capabilities. It excels in applications such as data centers, cloud computing services, and artificial intelligence training models. This device supports a wide range of operating temperatures from -40¡ãC to +85¡ãC, ensuring reliability across various environmental conditions.
Key Advantages
1. High clock speed up to 600 MHz, providing superior computational performance.
2. Advanced memory interface supporting DDR4 at speeds up to 2666 MT/s, enhancing data throughput.
3. Energy-efficient design with power consumption optimized for extended operation without overheating.
4. Compliance with industry-standard certifications like ISO 9001 and CE marking, ensuring quality and safety.
Frequently Asked Questions
Q1: Can the XC7S75-2FGGA484I operate effectively in extreme temperatures?
A1: Yes, it operates within a broad temperature range (-40¡ãC to +85¡ãC), making it suitable for both indoor and outdoor applications.
Q2: What are the specific memory interfaces supported by the XC7S75-2FGGA484I?
A2: The XC7S75-2FGGA484I supports DDR4 memory interfaces with speeds up to 2666 MT/s, offering high-speed data transfer capabilities.
Q3: In which industries can I find applications for the XC7S75-2FGGA484I?
A3: Applications include data centers, cloud computing, AI training, and high-performance computing, where high processing power and reliability are crucial.
Other people’s search terms
– High-performance computing solutions
– DDR4 memory support devices
– Temperature-resistant processors
– AI training hardware
– Cloud computing accelerators