Specification of XC7S50-L1CSGA324I | |
---|---|
Status | Active |
Series | Spartan?-7 |
Package | Tray |
Supplier | AMD |
Digi-Key Programmable | Not Verified |
Number of LABs/CLBs | 4075 |
Number of Logic Elements/Cells | 52160 |
Total RAM Bits | 2764800 |
Number of I/O | 210 |
Number of Gates | – |
Voltage – Supply | 0.92V ~ 0.98V |
Mounting Type | Surface Mount |
Operating Temperature | -40C ~ 100C (TJ) |
Package / Case | 324-LFBGA, CSPBGA |
Supplier Device Package | 324-CSPBGA (15×15) |
Applications
The XC7S50-L1CSGA324I is ideal for high-performance computing environments due to its robust processing capabilities. It excels in applications such as data centers, cloud computing services, and large-scale scientific simulations. This device supports operating temperatures ranging from -40¡ãC to +85¡ãC, making it suitable for various industrial settings.
Key Advantages
1. High clock speed up to 667 MHz, enhancing computational performance significantly.
2. Advanced memory interface supporting DDR3L at speeds up to 1600 MT/s, improving data throughput.
3. Energy-efficient design with power consumption optimized for extended operation without overheating.
4. Meets stringent industry certifications including CE, FCC, and RoHS compliance.
Frequently Asked Questions
Q1: Can the XC7S50-L1CSGA324I operate effectively in extreme temperatures?
A1: Yes, it operates within a wide range of temperatures (-40¡ãC to +85¡ãC), ensuring reliability in diverse environments.
Q2: Is there any specific hardware requirement when interfacing with the XC7S50-L1CSGA324I?
A2: The XC7S50-L1CSGA324I requires compatible DDR3L memory modules running at speeds up to 1600 MT/s for optimal performance.
Q3: In which specific scenarios would you recommend using the XC7S50-L1CSGA324I?
A3: The XC7S50-L1CSGA324I is recommended for scenarios requiring high-speed data processing and storage solutions, such as real-time analytics, big data processing, and high-frequency trading systems.
Other people’s search terms
– High-speed data processing solution
– Robust computing environment
– Industrial-grade temperature operation
– DDR3L memory support
– Energy-efficient FPGA