Specification of XC6VLX130T-L1FF1156I | |
---|---|
Status | Active |
Series | Virtex?-6 LXT |
Package | Tray |
Supplier | AMD |
Digi-Key Programmable | Not Verified |
Number of LABs/CLBs | 10000 |
Number of Logic Elements/Cells | 128000 |
Total RAM Bits | 9732096 |
Number of I/O | 600 |
Number of Gates | – |
Voltage – Supply | 0.91V ~ 0.97V |
Mounting Type | Surface Mount |
Operating Temperature | -40C ~ 100C (TJ) |
Package / Case | 1156-BBGA, FCBGA |
Supplier Device Package | 1156-FCBGA (35×35) |
Applications
The XC6VLX130T-L1FF1156I is ideal for high-performance computing environments due to its advanced processing capabilities. It excels in applications such as artificial intelligence training, big data analytics, and cloud computing services. This device operates within a wide range of temperatures from -40¡ãC to +85¡ãC, ensuring reliability across various environmental conditions.
Key Advantages
1. High clock speed up to 700 MHz, providing superior computational performance.
2. Advanced memory interface supporting DDR4 at speeds up to 2666 MT/s, enhancing data throughput.
3. Energy-efficient design with power consumption optimized for extended operation without overheating.
4. Meets stringent industrial standards including CE, FCC, and RoHS certifications.
Frequently Asked Questions
Q1: Can the XC6VLX130T-L1FF1156I be used in high-temperature environments?
A1: Yes, it can operate effectively between -40¡ãC and +85¡ãC, making it suitable for both indoor and outdoor applications.
Q2: What are the specific memory interfaces supported by this device?
A2: The XC6VLX130T-L1FF1156I supports DDR4 memory with speeds up to 2666 MT/s, which is beneficial for high-speed data processing tasks.
Q3: In which industries is the XC6VLX130T-L1FF1156I commonly used?
A3: Commonly used in sectors like telecommunications, automotive, and aerospace, where high-performance and reliability are paramount.
Other people’s search terms
– High-performance computing solutions
– Artificial intelligence hardware components
– Cloud computing infrastructure requirements
– Industrial-grade memory interface technology
– Energy-efficient processor specifications