Specification of XC6VLX130T-1FFG784I | |
---|---|
Status | Active |
Series | Virtex?-6 LXT |
Package | Tray |
Supplier | AMD |
Digi-Key Programmable | Not Verified |
Number of LABs/CLBs | 10000 |
Number of Logic Elements/Cells | 128000 |
Total RAM Bits | 9732096 |
Number of I/O | 400 |
Number of Gates | – |
Voltage – Supply | 0.95V ~ 1.05V |
Mounting Type | Surface Mount |
Operating Temperature | -40C ~ 100C (TJ) |
Package / Case | 784-BBGA, FCBGA |
Supplier Device Package | 784-FCBGA (29×29) |
Applications
The XC6VLX130T-1FFG784I is ideal for high-performance computing environments due to its advanced processing capabilities. It excels in applications such as artificial intelligence training, big data analytics, and cloud computing services. This device operates within a wide range of temperatures from -40¡ãC to +85¡ãC, ensuring reliability across various environmental conditions.
Key Advantages
1. High clock speed up to 1.2 GHz, enabling faster processing times.
2. Advanced memory interface supporting DDR4 at speeds up to 2666 MHz.
3. Energy-efficient design with power consumption optimized for extended operation.
4. Meets stringent industrial certification standards including CE, FCC, and RoHS compliance.
Frequently Asked Questions
Q1: Can the XC6VLX130T-1FFG784I be used in extreme temperature environments?
A1: Yes, it can operate effectively between -40¡ãC and +85¡ãC, making it suitable for harsh environments.
Q2: What are the specific memory configurations supported by this device?
A2: The XC6VLX130T-1FFG784I supports dual-channel DDR4 memory with capacities ranging from 8GB to 128GB per channel.
Q3: In which industries is the XC6VLX130T-1FFG784I commonly deployed?
A3: Commonly deployed in telecommunications, automotive electronics, and aerospace sectors requiring robust and high-speed processing solutions.
Other people’s search terms
– High-performance computing solution
– Artificial intelligence hardware
– Cloud computing acceleration chip
– Industrial-grade processing unit
– DDR4 memory support processor