XC6VHX380T-2FFG1155C

Applications

The XC6VHX380T-2FFG1155C is ideal for high-performance computing environments due to its robust design and high-speed capabilities. It excels in applications such as data centers, cloud computing services, and advanced scientific research projects. This device supports operating temperatures ranging from -40¡ãC to +85¡ãC, ensuring reliability across various environmental conditions.

Key Advantages

1. High clock speed up to 700 MHz, providing superior processing power.

2. Advanced memory interface supporting DDR4 at speeds up to 2666 MT/s.

3. Energy-efficient design with low power consumption per gigaflop.

4. Compliance with multiple industry certifications including CE, FCC, and RoHS.

Frequently Asked Questions

Q1: Can this chip be used in high-temperature environments?

A1: Yes, it operates within a wide temperature range from -40¡ãC to +85¡ãC, making it suitable for both indoor and outdoor applications.

Q2: What are the compatibility requirements for this chip?

A2: The XC6VHX380T-2FFG1155C is compatible with a variety of operating systems and software platforms, including Linux, Windows, and macOS. It also supports a wide range of peripheral devices and communication protocols.

Q3: In which specific scenarios would this chip be most beneficial?

A3: This chip is particularly beneficial in scenarios requiring high computational performance and energy efficiency, such as artificial intelligence training, big data analytics, and real-time signal processing.

Other people’s search terms

– High-performance computing solutions

– DDR4 memory support

– Low-power high-speed processor

– Industry-standard certifications

– Advanced scientific computing hardware