Shopping Cart

购物车里没有产品。

XC2V2000-4FGG676I

Part Number XC2V2000-4FGG676I
Manufacturer Xilinx
Description IC FPGA 456 I/O 676FBGA
Datasheets Download XC2V2000-4FGG676I Datasheet PDFPDF Icon
Price for XC2V2000-4FGG676I
Specification of XC2V2000-4FGG676I
Status Obsolete
Series Virtex?-II
Package Tray
Supplier AMD
Digi-Key Programmable Not Verified
Number of LABs/CLBs 2688
Number of Logic Elements/Cells
Total RAM Bits 1032192
Number of I/O 456
Number of Gates 2000000
Voltage – Supply 1.425V ~ 1.575V
Mounting Type Surface Mount
Operating Temperature -40C ~ 100C (TJ)
Package / Case 676-BGA
Supplier Device Package 676-FBGA (27×27)

Applications

The XC2V2000-4FGG676I is ideal for high-performance computing environments due to its robust design and high-speed capabilities. It excels in server farms where it can handle complex computational tasks efficiently, supporting applications like big data analytics and machine learning models.

In the automotive sector, this chip is used in advanced driver-assistance systems (ADAS), enabling features such as lane departure warning and adaptive cruise control. Its ability to process sensor data quickly ensures safety-critical functions operate reliably.

For industrial automation, the XC2V2000-4FGG676I powers machinery control systems that require precise timing and high reliability. It supports applications like robotic arms and automated assembly lines, ensuring smooth operation without downtime.

In telecommunications infrastructure, this component enhances network performance by improving signal processing and data transmission rates. It is crucial for 5G networks, supporting faster data transfer speeds and lower latency.

The chip operates within a wide range of temperatures (-40¡ãC to +85¡ãC) making it suitable for various environmental conditions, from harsh outdoor settings to controlled indoor environments.

Key Advantages

1. High clock speed up to 400 MHz, enhancing processing power significantly.

2. Advanced memory interface technology for faster data transfer rates.

3. Low power consumption, reducing operational costs and heat generation.

4. Compliance with multiple industry-standard certifications, ensuring reliability and security.

Frequently Asked Questions

Q1: Can the XC2V2000-4FGG676I be used in extreme temperature environments?

A1: Yes, it operates effectively between -40¡ãC and +85¡ãC, making it suitable for both cold and hot climates.

Q2: What are the specific compatibility requirements for this chip?

A2: The XC2V2000-4FGG676I is compatible with a variety of standard buses and interfaces, including PCI Express and USB 3.0, ensuring seamless integration into existing systems.

Q3: In which specific scenarios would you recommend using this XC2V2000-4FGG676I?

A3: This chip is recommended for scenarios requiring high-speed data processing and low-latency operations, such as real-time data analysis in financial markets and high-frequency trading systems.

Other people’s search terms

– High-speed computing solutions

– Automotive ADAS components

– Industrial automation processors

– Telecommunications network enhancement chips

– Robust temperature range ICs

Procurement advantages

1.Fast quote response guaranteed within 24 hours via email or ERP system integration.
2.Global express delivery options ensure components arrive within 48 hours from order confirmation.
3.Inventory exceeding ten million units across multiple warehouses guarantees stock availability.
4.Full BOM LIST procurement support with automated component matching.
5.Free samples available for testing; bulk orders qualify for tiered pricing discounts.

Secure Payments
Payment through formal channels, more secure
Global Logistics
Global logistics are available for delivery
B2B Sales
B2B volume purchases can be more favourable
24/7 Support
Each customer has his own customer service

Important updates waiting for you!

Subscribe and grab 10% OFF!