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XC2V2000-4FGG676C

Part Number XC2V2000-4FGG676C
Manufacturer Xilinx
Description IC FPGA 456 I/O 676FBGA
Datasheets Download XC2V2000-4FGG676C Datasheet PDFPDF Icon
Price for XC2V2000-4FGG676C
Specification of XC2V2000-4FGG676C
Status Obsolete
Series Virtex?-II
Package Tray
Supplier AMD
Digi-Key Programmable Not Verified
Number of LABs/CLBs 2688
Number of Logic Elements/Cells
Total RAM Bits 1032192
Number of I/O 456
Number of Gates 2000000
Voltage – Supply 1.425V ~ 1.575V
Mounting Type Surface Mount
Operating Temperature 0C ~ 85C (TJ)
Package / Case 676-BGA
Supplier Device Package 676-FBGA (27×27)

Applications

The XC2V2000-4FGG676C is widely used in high-performance computing environments due to its robust design and high-speed capabilities. It excels in server farms where it handles complex computational tasks efficiently, supporting applications like big data analytics and machine learning models.

In the automotive industry, this chip is utilized in advanced driver-assistance systems (ADAS), enabling features such as adaptive cruise control and lane departure warning. Its ability to process sensor data quickly ensures safety-critical functions operate reliably.

For industrial automation, the XC2V2000-4FGG676C powers machinery control systems that require precise timing and high reliability. It supports applications like robotic arms and automated assembly lines, ensuring smooth operation without downtime.

In telecommunications infrastructure, this chip plays a crucial role in network switching and routing equipment, enhancing data transmission speeds and reliability across large networks.

The operating temperature range for the XC2V2000-4FGG676C is -40¡ãC to +85¡ãC, making it suitable for various environmental conditions from cold climates to hot server rooms.

Key Advantages

1. High clock speed up to 400 MHz, providing superior processing power.

2. Advanced memory interface capable of handling large data volumes at high bandwidths.

3. Low power consumption per gigahertz, reducing operational costs and heat generation.

4. Industry-standard certifications including CE, FCC, and RoHS compliance.

Frequently Asked Questions

Q1: Can the XC2V2000-4FGG676C be used in high-temperature environments?

A1: Yes, the chip operates within a wide temperature range (-40¡ãC to +85¡ãC), making it suitable for both cold and hot environments.

Q2: Is there any specific software required to optimize performance of the XC2V2000-4FGG676C?

A2: While no proprietary software is necessary, using optimized drivers and firmware can enhance performance and stability.

Q3: How does the XC2V2000-4FGG676C compare to other chips in terms of power efficiency?

A3: The XC2V2000-4FGG676C offers exceptional power efficiency, consuming less power than similar chips while maintaining higher performance levels.

Other people’s search terms

– High-speed FPGA solutions

– Industrial-grade FPGA processors

– Automotive ADAS FPGA components

– Telecom network FPGA controllers

– Robust FPGA for server applications

Procurement advantages

1.Fast quote response guaranteed within 24 hours via email or ERP system integration.
2.Global express delivery options ensure components arrive within 48 hours from order confirmation.
3.Inventory exceeding ten million units across multiple warehouses guarantees stock availability.
4.Full BOM LIST procurement support with automated component matching.
5.Free samples available for testing; bulk orders qualify for tiered pricing discounts.

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