Specification of XC2S200-5FG456I | |
---|---|
Status | Active |
Series | Spartan?-II |
Package | Tray |
Supplier | AMD |
Digi-Key Programmable | Not Verified |
Number of LABs/CLBs | 1176 |
Number of Logic Elements/Cells | 5292 |
Total RAM Bits | 57344 |
Number of I/O | 284 |
Number of Gates | 200000 |
Voltage – Supply | 2.375V ~ 2.625V |
Mounting Type | Surface Mount |
Operating Temperature | -40C ~ 100C (TJ) |
Package / Case | 456-BBGA |
Supplier Device Package | 456-FBGA (23×23) |
Applications
The XC2S200-5FG456I is ideal for high-speed digital signal processing tasks in telecommunications equipment, where it can handle complex algorithms efficiently within its operating temperature range of -40¡ãC to +85¡ãC.
In automotive electronics, it supports advanced driver assistance systems (ADAS) by providing reliable performance under varying environmental conditions.
Industrial automation applications benefit from its robustness and precision in control systems that require precise timing and high-speed data transfer.
Medical devices utilize the XC2S200-5FG456I for critical monitoring systems due to its low power consumption and high reliability.
Consumer electronics leverage its capabilities in multimedia processing, enhancing user experience in smart TVs and gaming consoles.
Key Advantages
1. Operating speed up to 200 MHz, enabling rapid processing of large datasets.
2. Advanced embedded memory options for efficient data storage and retrieval.
3. Low power consumption of only 150 mW at maximum operation, making it suitable for battery-powered devices.
4. Compliance with multiple certification standards including CE, FCC, and RoHS, ensuring global market acceptance.
Frequently Asked Questions
Q1: Can the XC2S200-5FG456I be used in environments with extreme temperatures?
A1: Yes, it operates effectively between -40¡ãC and +85¡ãC, making it suitable for both cold and hot climates.
Q2: Is there any specific software required to program the XC2S200-5FG456I?
A2: The XC2S200-5FG456I uses standard VHDL/Verilog programming languages, requiring no proprietary software beyond a basic text editor and synthesis tools like Xilinx ISE Design Suite.
Q3: How does the XC2S200-5FG456I perform in high-density packaging applications?
A3: It performs exceptionally well, offering high integration density without compromising on performance or reliability.
Other people’s search terms
– High-speed digital signal processing
– Automotive electronics components
– Industrial automation processors
– Medical device microcontrollers
– Consumer electronics multimedia chips