| Specification of XCVU37P-3FSVH2892E | |
|---|---|
| Status | Active |
| Series | Virtex? UltraScale+? |
| Package | Tray |
| Supplier | AMD |
| Digi-Key Programmable | Not Verified |
| Number of LABs/CLBs | 162960 |
| Number of Logic Elements/Cells | 2851800 |
| Total RAM Bits | 74344038 |
| Number of I/O | 624 |
| Number of Gates | – |
| Voltage – Supply | 0.873V ~ 0.927V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0C ~ 100C (TJ) |
| Package / Case | 2892-BBGA, FCBGA |
| Supplier Device Package | 2892-FCBGA (55×55) |
Applications
The XCVU37P-3FSVH2892E is ideal for high-performance computing environments such as data centers, AI training, and machine learning tasks. It excels in handling large datasets efficiently due to its high processing power and memory bandwidth. This device is also suitable for automotive applications requiring robust and reliable performance under varying conditions.
Key Advantages
1. High clock speed up to 600 MHz
2. Advanced multi-core architecture
3. Low power consumption per gigaflop
4. Compliance with ISO 26262 safety standards
Frequently Asked Questions
Q1: What is the maximum operating temperature supported by the XCVU37P-3FSVH2892E?
A1: The XCVU37P-3FSVH2892E supports operation at temperatures up to 85¡ãC.
Q2: Can the XCVU37P-3FSVH2892E be used in conjunction with other components from the same series?
A2: Yes, it can be integrated with other devices from the same series to form complex systems.
Q3: In which specific scenarios would you recommend using the XCVU37P-3FSVH2892E over alternatives?
A3: The XCVU37P-3FSVH2892E is recommended for scenarios requiring high computational throughput and low latency, such as real-time analytics and high-frequency trading.
Other people’s search terms
– High-performance computing solutions
– Automotive-grade processors
– AI acceleration hardware
– Data center optimization tools
– Safety-critical embedded systems
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