Specification of XC2S30-5TQG144C | |
---|---|
Status | Active |
Series | Spartan?-II |
Package | Tray |
Supplier | AMD |
Digi-Key Programmable | Not Verified |
Number of LABs/CLBs | 216 |
Number of Logic Elements/Cells | 972 |
Total RAM Bits | 24576 |
Number of I/O | 92 |
Number of Gates | 30000 |
Voltage – Supply | 2.375V ~ 2.625V |
Mounting Type | Surface Mount |
Operating Temperature | 0C ~ 85C (TJ) |
Package / Case | 144-LQFP |
Supplier Device Package | 144-TQFP (20×20) |
Applications
The XC2S30-5TQG144C is ideal for high-speed digital signal processing tasks in telecommunications equipment, where it can handle complex algorithms efficiently within its specified operating temperature range of -40¡ãC to +85¡ãC.
In automotive electronics, it supports advanced driver assistance systems (ADAS) by providing reliable performance under varying environmental conditions.
Industrial automation applications benefit from its robustness and precision in control systems that require precise timing and data integrity.
Key Advantages
1. Operating speed up to 667 MHz, enabling rapid processing of large datasets.
2. Advanced embedded memory features for efficient data storage and retrieval.
3. Low power consumption, reducing operational costs and extending battery life in portable devices.
4. Compliance with multiple industry standards such as ISO 9001 and CE marking.
Frequently Asked Questions
Q1: Can the XC2S30-5TQG144C be used in environments with extreme temperatures?
A1: Yes, it operates effectively between -40¡ãC and +85¡ãC, making it suitable for both cold and hot climates.
Q2: Is there any specific hardware requirement when interfacing with the XC2S30-5TQG144C?
A2: The XC2S30-5TQG144C requires standard 2.5V logic levels and supports various communication protocols like SPI and I2C without additional hardware modifications.
Q3: How does the XC2S30-5TQG144C perform in high-density packaging environments?
A3: It performs well in high-density environments due to its compact size and low thermal resistance, ensuring minimal heat dissipation issues.
Other people’s search terms
– High-speed digital signal processing
– Automotive electronics components
– Industrial automation solutions
– Embedded memory technology
– Low-power consumption microcontrollers