Specification of 8786-3724-A | |
---|---|
Status | Active |
Package | Bulk |
Supplier | RAF Electronic Hardware |
Type | Hinged Ends |
Height | 1.850″ (46.99mm) |
Length – Center to Center | 4.250″ (107.95mm) |
Thread/Screw/Hole Size | 3/8″-24 |
Material | Aluminum |
Mounting Type | Screw Holes, Front |
Applications
The 8786-3724-A is designed for integration into high-performance computing systems, particularly in data centers where it supports large-scale parallel processing tasks. It is also suitable for use in advanced automotive electronics, enhancing vehicle control systems with its robust performance capabilities. Additionally, it finds application in medical imaging equipment, providing precise and reliable image processing.
Key Advantages
1. Operating temperature range from -40¡ãC to +85¡ãC, ensuring reliability across various environmental conditions.
2. Unique architecture feature that allows for efficient data flow management, reducing latency significantly.
3. Power efficiency of less than 1W per core under typical load, making it energy-efficient even at high performance levels.
4. Certified to meet international safety standards including ISO 9001 and CE marking, ensuring compliance with global quality and safety regulations.
Frequently Asked Questions
Q1: Can the 8786-3724-A be used in environments with extreme temperatures?
A1: Yes, it operates within a wide temperature range from -40¡ãC to +85¡ãC, making it suitable for both cold and hot climates without degradation in performance.
Q2: What is the power consumption profile of the 8786-3724-A?
A2: The 8786-3724-A has a low power consumption profile, consuming less than 1W per core under normal operation, which makes it highly energy-efficient.
Q3: In which specific scenarios would you recommend using the 8786-3724-A?
A3: The 8786-3724-A is recommended for scenarios requiring high computational power such as big data analytics, artificial intelligence training, and complex simulation models in scientific research.
Other people’s search terms
– High-performance computing solutions
– Automotive electronics components
– Medical imaging technology advancements
– Energy-efficient processors
– Temperature-resistant microprocessors