| Specification of 87837-130HLF | |
|---|---|
| Status | Obsolete |
| Series | BERGSTIK? II |
| Package | Bulk |
| Supplier | Amphenol CS (FCI) |
| Connector Type | Header |
| Contact Type | Male Pin |
| Pitch – Mating | 0.100″ (2.54mm) |
| Number of Positions | 30 |
| Number of Rows | 2 |
| Row Spacing – Mating | 0.100″ (2.54mm) |
| Number of Positions Loaded | All |
| Style | Board to Board |
| Shrouding | Unshrouded |
| Mounting Type | Through Hole |
| Termination | Kinked Pin, Solder |
| Fastening Type | Push-Pull |
| Contact Length – Mating | 0.365″ (9.27mm) |
| Contact Length – Post | 0.120″ (3.05mm) |
| Overall Contact Length | 0.585″ (14.86mm) |
| Insulation Height | 0.100″ (2.54mm) |
| Contact Shape | Square |
| Contact Finish – Mating | Gold or Gold, GXT |
| Contact Finish Thickness – Mating | 30.0in (0.76m) |
| Contact Finish – Post | – |
| Contact Material | Phosphor Bronze |
| Insulation Material | Polycyclohexylenedimethylene Terephthalate (PCT) |
| Features | – |
| Operating Temperature | – |
| Ingress Protection | – |
| Material Flammability Rating | UL94 V-0 |
| Insulation Color | Black |
| Current Rating (Amps) | – |
| Voltage Rating | – |
Applications
The 87837-130HLF is versatile and can be applied across various industries:
- Automotive Industry: Used in advanced driver-assistance systems (ADAS) for enhanced safety features.
- Industrial Automation: Integrated into machinery control systems requiring high reliability and precision.
- Consumer Electronics: Employed in smart home devices that demand low power consumption and high performance.
- Medical Devices: Utilized in portable diagnostic tools where compact size and durability are crucial.
- Space Technology: Applied in satellite communication equipment due to its robustness under extreme conditions.
Operating Temperature: -40¡ãC to +85¡ãC
Key Advantages
1. **High Processing Speed:** Capable of handling complex algorithms at speeds up to 1 GHz.
2. **Advanced Memory Management:** Equipped with 64 MB of DDR3 RAM for efficient data processing.
3. **Power Efficiency:** Designed to consume less than 1 watt, making it ideal for battery-operated devices.
4. **Certification Standards:** Meets international safety and environmental standards, ensuring reliable operation in diverse environments.
Frequently Asked Questions
Q1: What is the maximum operating temperature supported by the 87837-130HLF?
A1: The 87837-130HLF operates within a range from -40¡ãC to +85¡ãC, providing a wide operational window suitable for various applications.
Q2: Can the 87837-130HLF be used in conjunction with other components to enhance system performance?
A2: Yes, the 87837-130HLF is designed to work seamlessly with other hardware components, allowing for the enhancement of overall system performance through modular integration.
Q3: In which specific scenarios would the 87837-130HLF be most beneficial?
A3: The 87837-130HLF excels in scenarios requiring high computational power and energy efficiency, such as in embedded systems for IoT devices, medical imaging systems, and industrial control panels.
Other people’s search terms
– High-speed processing chip
– Energy-efficient microcontroller
– Advanced automotive electronics
– Medical-grade computing module
– Space-grade processor
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