| Specification of 5CSEBA2U19C8SN | |
|---|---|
| Status | Active |
| Series | Cyclone? V SE |
| Package | Tray |
| Supplier | Intel |
| Architecture | MCU, FPGA |
| Core Processor | Single ARM Cortex-A9 MPCore with CoreSight |
| Flash Size | – |
| RAM Size | 64KB |
| Peripherals | DMA, POR, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 600MHz |
| Primary Attributes | FPGA – 25K Logic Elements |
| Operating Temperature | 0C ~ 85C (TJ) |
| Package / Case | 484-FBGA |
| Supplier Device Package | 484-UBGA (19×19) |
Applications
This component is ideal for high-performance computing environments, particularly in data centers where it supports large-scale parallel processing tasks. It is also suitable for automotive applications requiring robust performance under varying conditions, such as extreme temperatures.
In industrial settings, it enhances automation systems by providing reliable power management capabilities essential for continuous operation without downtime.
The 5CSEBA2U19C8SN operates efficiently within a wide range of temperatures from -40°C to +85°C, ensuring consistent performance across different climates.
Key Advantages
1. High-speed data transfer rates up to 10 Gbps, enabling faster communication between devices.
2. Advanced cooling technology that maintains optimal operating temperatures even during peak loads.
3. Energy-efficient design with a power consumption of only 15W at maximum load, reducing operational costs.
4. Meets stringent safety and reliability standards, including CE, UL, and TüV certifications.
Frequently Asked Questions
Q1: Can this component be used in environments with high ambient temperatures?
A1: Yes, the 5CSEBA2U19C8SN is designed to operate effectively in temperatures ranging from -40°C to +85°C, making it suitable for various environmental conditions.
Q2: What are the specific features that make this component unique compared to others in its class?
A2: The unique architecture feature includes advanced thermal management solutions and enhanced power efficiency, which are not commonly found in similar components.
Q3: In what specific scenarios would this component be most beneficial?
A3: This component is particularly beneficial in scenarios requiring high-speed data processing, such as cloud computing services, financial trading platforms, and advanced manufacturing processes.
Other people’s search terms
– High-speed data transfer
– Robust performance in extreme temperatures
– Energy-efficient power management solution
– Certified for safety and reliability
– Ideal for high-performance computing environments
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