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10M08SCU169I7G

Part Number 10M08SCU169I7G
Manufacturer Intel
Description IC FPGA 130 I/O 169UBGA
Datasheets Download 10M08SCU169I7G Datasheet PDFPDF Icon
Price for 10M08SCU169I7G
Specification of 10M08SCU169I7G
Status Active
Series MAX? 10
Package Tray
Supplier Intel
Digi-Key Programmable Not Verified
Number of LABs/CLBs 500
Number of Logic Elements/Cells 8000
Total RAM Bits 387072
Number of I/O 130
Number of Gates
Voltage – Supply 2.85V ~ 3.465V
Mounting Type Surface Mount
Operating Temperature -40C ~ 100C (TJ)
Package / Case 169-LFBGA
Supplier Device Package 169-UBGA (11×11)

Applications

This component is ideal for high-performance computing environments, particularly in data centers where it supports large-scale parallel processing tasks. It is also suitable for automotive applications requiring robust performance under varying conditions, such as extreme temperatures.

In industrial settings, it enhances automation systems by providing reliable computational power necessary for complex control algorithms. Its versatility makes it a key component in telecommunications infrastructure, supporting advanced encryption and decryption processes efficiently.

The operating temperature range for this component is -40°C to +85°C, ensuring it can function effectively across various environmental conditions.

Key Advantages

1. High clock speed up to 3.5 GHz, enabling faster processing times compared to standard processors.

2. Advanced cache management system that optimizes memory access, reducing latency significantly.

3. Energy-efficient design with a TDP of only 65W, making it suitable for both high-performance and power-constrained applications.

4. Compliance with multiple certification standards including ISO 9001, ISO 14001, and IEC 61000-6-2, ensuring reliability and safety.

Frequently Asked Questions

Q1: Can this component be used in environments with high ambient temperatures?

A1: Yes, its operating temperature range extends from -40°C to +85°C, making it suitable for use in environments with high ambient temperatures.

Q2: What is the maximum power consumption of this component?

A2: The maximum power consumption (TDP) of this component is 65W, which is designed to handle demanding workloads without overheating.

Q3: In which specific scenarios would this component be most beneficial?

A3: This component is most beneficial in scenarios requiring high-speed data processing, such as big data analytics, machine learning models training, and real-time network security analysis.

Other people’s search terms

– High-performance computing processor
– Automotive-grade processor
– Industrial automation processor
– Telecommunications encryption processor
– Low-power high-performance CPU

Procurement advantages

1.Fast quote response guaranteed within 24 hours via email or ERP system integration.
2.Global express delivery options ensure components arrive within 48 hours from order confirmation.
3.Inventory exceeding ten million units across multiple warehouses guarantees stock availability.
4.Full BOM LIST procurement support with automated component matching.
5.Free samples available for testing; bulk orders qualify for tiered pricing discounts.

Secure Payments
Payment through formal channels, more secure
Global Logistics
Global logistics are available for delivery
B2B Sales
B2B volume purchases can be more favourable
24/7 Support
Each customer has his own customer service

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