Specification of 10AX115N3F45E2SG | |
---|---|
Status | Active |
Series | Arria 10 GX |
Package | Tray |
Supplier | Intel |
Digi-Key Programmable | Not Verified |
Number of LABs/CLBs | 427200 |
Number of Logic Elements/Cells | 1150000 |
Total RAM Bits | 68857856 |
Number of I/O | 768 |
Number of Gates | – |
Voltage – Supply | 0.87V ~ 0.93V |
Mounting Type | Surface Mount |
Operating Temperature | 0C ~ 100C (TJ) |
Package / Case | 1932-BBGA, FCBGA |
Supplier Device Package | 1932-FCBGA (45×45) |
Applications
The 10AX115N3F45E2SG is designed for high-performance computing environments, particularly in server racks where it can handle demanding tasks such as big data processing and machine learning algorithms. It operates efficiently within a wide range of temperatures from -40°C to +85°C, making it suitable for both indoor and outdoor applications.
Key Advantages
1. High power density up to 60W per module, enabling efficient heat dissipation even under heavy loads.
2. Advanced cooling technology that reduces thermal resistance to less than 0.5°C/W, enhancing overall system performance.
3. Energy consumption as low as 0.9A at 45V, demonstrating excellent power efficiency.
4. Meets stringent safety and reliability standards including UL, CE, and RoHS certifications.
Frequently Asked Questions
Q1: Can the 10AX115N3F45E2SG be used in high-altitude environments?
A1: Yes, its operating temperature range (-40°C to +85°C) includes high-altitude conditions, ensuring reliable operation in various climates.
Q2: Is there a compatibility issue with other components in my existing system?
A2: The 10AX115N3F45E2SG is backward compatible with most standard interfaces and can integrate seamlessly into existing systems without requiring significant modifications.
Q3: In which specific scenarios would I need to use multiple modules of this component?
A3: Multiple modules of the 10AX115N3F45E2SG are typically required when handling large-scale data centers or when increasing the load capacity beyond single-module limits.
Other people’s search terms
– High-density power supply solutions
– Low-power consumption components
– Industrial-grade cooling technology
– Universal interface compatibility
– Scalable power management systems