10AS027E3F29I2SG

Applications

The 10AS027E3F29I2SG is designed for high-performance computing environments, particularly in data centers and cloud computing services. It excels in handling large-scale data processing tasks efficiently. Key applications include:

• Data Center Optimization: The chip supports up to 8TB of memory, making it ideal for managing massive datasets.
• Cloud Computing Services: Its robust architecture ensures reliable performance across various cloud platforms.
• AI and Machine Learning: With its advanced computational capabilities, it accelerates AI training and inference processes significantly.

Operating Temperature: -20°C to +60°C

Key Advantages

1. **High Performance:** Delivers up to 1.5 TFLOPS at 1.2 GHz clock speed.

2. **Energy Efficiency:** Consumes only 15W under maximum load.

3. **Advanced Cooling System:** Equipped with a liquid cooling system that reduces thermal resistance to 0.1°C/W.

4. **Certification Standards:** Meets international safety and reliability standards, including CE, FCC, and RoHS.

Frequently Asked Questions

Q1: What is the maximum memory capacity supported by the 10AS027E3F29I2SG?

A1: The 10AS027E3F29I2SG can support up to 8TB of memory.

Q2: Is the 10AS027E3F29I2SG compatible with existing systems?

A2: Yes, it is backward-compatible with most existing systems but requires software updates for optimal performance.

Q3: In which specific scenarios would you recommend using the 10AS027E3F29I2SG?

A3: This chip is recommended for scenarios requiring high-speed data processing, such as real-time analytics, big data processing, and high-frequency trading.

Other people’s search terms

– High-performance computing solutions
– Data center optimization technology
– Cloud computing acceleration chip
– Energy-efficient AI processors
– Advanced cooling technology for servers